Vertiv is making its CoolChip CDU 2300 and CoolChip Fluid Network Row Manifolds available across Europe, the Middle East, and Africa, expanding the company's liquid cooling portfolio at a point when data centre operators are under pressure to accommodate GPU-dense racks that air cooling cannot reliably handle.
The CDU 2300 is a liquid-to-liquid coolant distribution unit delivering 2.3 megawatts of cooling capacity in a compact footprint, which Vertiv says gives it one of the highest capacity-to-footprint ratios available. Its controller adapts temperature and flow to workload demands and communicates unit-to-unit, allowing operators to run coordinated thermal management across large-scale deployments without custom integration work. The cabinet is sized for flexible placement, including in-row or in adjacent mechanical areas.
The Fluid Network Row Manifolds handle the connectivity layer: they link coolant distribution units, server-level cooling hardware, and heat rejection systems, and are pre-flushed, passivated, pressure-tested, and sealed before shipping. Vertiv says the configurable design supports direct-to-chip, immersion, and rear-door heat exchanger configurations, and that operators can retrofit existing deployments or stand up new builds in weeks rather than months.
The rapid growth of AI workloads is driving a fundamental shift in how data centres are designed, cooled, powered and operated
Both products slot into Vertiv's broader thermal chain, which the company describes as an end-to-end portfolio spanning power, cooling, heat rejection, intelligent controls, and lifecycle services. The intent is to give data centre operators a single vendor relationship across the infrastructure components that determine whether an AI training cluster stays within operating temperature.
"The rapid growth of AI workloads is driving a fundamental shift in how data centres are designed, cooled, powered and operated," said Paul Ryan, president for EMEA at Vertiv. "At Datacloud Global Congress, we're showing how Vertiv is expanding its end-to-end portfolio, combining high-density power solutions, liquid cooling, heat rejection, intelligent controls, and lifecycle services, to help customers deploy AI-ready infrastructure faster and operate more efficiently over time."
The products will be on display at Datacloud Global Congress in Cannes from 1 to 4 June, where Vertiv is a Patron Sponsor.
