Mitsubishi Electric, Carrier Ventures and Samsung Electronics — via its corporate venture arm Samsung Ventures — led the round, with Goldman Sachs serving as exclusive placement agent. The investment follows a period in which ZutaCore logged more than 75 production deployments across the Americas, Europe and Asia.
The backdrop is straightforward: AI processors are generating heat loads that conventional cooling cannot handle. ZutaCore's two-phase platform is designed to run chips drawing over 4,000 watts without water contact — a constraint that matters in data centres where even small leaks can cause catastrophic hardware failures.
Funding will go toward global expansion, next-generation R&D and scaling what the company describes as megawatt-class deployments. It has already established a 2 MW end-of-row emulation facility in Israel, allowing customers to validate thermal and facility performance before committing to full deployment.
The company recently introduced its OmniTherm cold plate, a single-slot PCIe component that extends waterless two-phase cooling to the NVIDIA RTX PRO 6000 Blackwell Server Edition — positioning ZutaCore's technology inside standard enterprise server environments rather than only purpose-built AI clusters.
Alongside the funding, ZutaCore announced four executive appointments: Yaniv Reinhold as CFO, Sarah Warshavsky Oberman as Chief People Officer, Yoni Nir as Chief Research and Development Officer, and Sharon Shafran as COO. The hires bring backgrounds spanning Coro Cybersecurity, HP and a range of enterprise technology operations.
Erez Freibach, Chairman and CEO, said the raise validates the technology at a moment when legacy infrastructure is genuinely struggling to keep pace with AI compute demands.
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